Rohm and Haas microfabrication and advanced packaging group is a leading global provider of optoelectronic components, MEMS wafer foundry services and advanced high frequency microwave and millimeter wave components and integration technology. Our mission is to deliver innovative electronics packaging and assembly solutions to provide miniaturization, integration, and cost reduction. We focus on two main technology platforms for product development. Our SI-PAK™ advanced optoelectronics packaging platform provides hermetic silicon microcavity packaging for 10-40Gb/s optoelectronic devices and our POLYSTRATA™ 3D microfabrication platform enables new microwave and mm-wave components and sub-system integration solutions from DC to 300 GHz. We will continue to develop innovations that will make Rohm and Haas the clear partner for next generation electronics packaging technology.